发明名称 |
Method of etching a metallic film on a substrate |
摘要 |
A method of etching a metallic film on a substrate. This method operates to inject an oxidizing agent through the use of a carrier gas to etch a source metal in the presence of a reducing agent such that the rate of etching can be controlled by controlling the flow rate of the carrier gas, the substrate temperature, the pulse widths of the oxidizing and reducing agents, and the number of etching phases.
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申请公布号 |
US7204935(B2) |
申请公布日期 |
2007.04.17 |
申请号 |
US20040838275 |
申请日期 |
2004.05.04 |
申请人 |
OREGON HEALTH & SCIENCE UNIVERSITY |
发明人 |
SOLANKI RAJENDRA;PATHANGEY BALU |
分类号 |
C23F1/00;C03C17/10;C03C17/22;C23C26/00 |
主分类号 |
C23F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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