METHOD FOR REDUCING THE INDUCTANCE IN SERIES WITH A DECOUPLING CAPACITOR FOR A BGA CHIP AND CORRESPONDING ASSEMBLY

摘要

A method of reducing the inductance in series with a decoupling capacitor for a ball grid array chip (100) . The ball grid array includes a plurality of conductive balls (106) coupled to conductive interconnects (302) exposed on a surface of a circuit board (300) . The surface includes a periphery and an interior and has conductive interconnects (302) exposed on both the interior and the periphery. The method includes physically positioning at least one decoupling capacitor (C, C1, C2) adjacent conductive interconnects (302) on the interior of the surface of the circuit board (300) and electrically coupling each capacitor to at least two of the adjacent conductive interconnects (302) .