| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric vibrator which can reduce a cost, and enables miniaturization and low height. SOLUTION: A metal film provided on a joining surface of a substrate wafer where it joins to a piezoelectric element wafer abuts on a metal film provided on a joining surface of the piezoelectric element wafer where it joins to the substrate wafer, and the substrate wafer overlaps on the piezoelectric element waver and bonded by green laser. A metal film provided on a joining surface of a lid wafer where it joins to the piezoelectric element wafer abuts on a metal film provided on a joining surface of the piezoelectric element wafer where it joins to the lid wafer, and the lid wafer overlaps on the piezoelectric element waver and bonded by green laser. The resulted wafer is singulated into piezoelectric vibrators in a state where the substrate wafer, the piezoelectric wafer and the lid wafer overlap and are bonded. COPYRIGHT: (C)2007,JPO&INPIT
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