发明名称 |
SURFACE-TREATED COPPER FOIL, PROCESS FOR PRODUCTION OF THE SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATES MADE BY USING THE FOIL |
摘要 |
<p>The invention aims at providing a surface-treated copper foil provided with a silane coupling agent treatment layer, which foil is improved in the tight adhesion observed when laminated with a resin substrate by hot pressing. In order to attain the aim, the invention provides a surface-treated copper foil having a silane coupling agent treatment layer on the adhesive surface to be bonded to a resin substrate, characterized in that the silane coupling agent treatment layer is formed with a bifunctional silane coupling agent having -Si(OCH<SUB>3</SUB>) functional groups at both ends of the chemical structure. The bifunctional silane coupling agent is any of bis-?-trimethoxysilylpropyl- amine, bis-?-trimethoxysilylpropylethylenediamine, and bis-? -trimethoxysilylethane.</p> |
申请公布号 |
WO2007040196(A1) |
申请公布日期 |
2007.04.12 |
申请号 |
WO2006JP319676 |
申请日期 |
2006.10.02 |
申请人 |
MITSUI MINING & SMELTING CO., LTD.;TAKAHASHI, MASARU;DOBASHI, MAKOTO |
发明人 |
TAKAHASHI, MASARU;DOBASHI, MAKOTO |
分类号 |
C23C26/00;B32B15/08;C23C22/00;H05K3/38 |
主分类号 |
C23C26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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