发明名称 SURFACE-TREATED COPPER FOIL, PROCESS FOR PRODUCTION OF THE SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATES MADE BY USING THE FOIL
摘要 <p>The invention aims at providing a surface-treated copper foil provided with a silane coupling agent treatment layer, which foil is improved in the tight adhesion observed when laminated with a resin substrate by hot pressing. In order to attain the aim, the invention provides a surface-treated copper foil having a silane coupling agent treatment layer on the adhesive surface to be bonded to a resin substrate, characterized in that the silane coupling agent treatment layer is formed with a bifunctional silane coupling agent having -Si(OCH&lt;SUB&gt;3&lt;/SUB&gt;) functional groups at both ends of the chemical structure. The bifunctional silane coupling agent is any of bis-?-trimethoxysilylpropyl- amine, bis-?-trimethoxysilylpropylethylenediamine, and bis-? -trimethoxysilylethane.</p>
申请公布号 WO2007040196(A1) 申请公布日期 2007.04.12
申请号 WO2006JP319676 申请日期 2006.10.02
申请人 MITSUI MINING & SMELTING CO., LTD.;TAKAHASHI, MASARU;DOBASHI, MAKOTO 发明人 TAKAHASHI, MASARU;DOBASHI, MAKOTO
分类号 C23C26/00;B32B15/08;C23C22/00;H05K3/38 主分类号 C23C26/00
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