| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method that not only improves the process for obtaining multiple devices by thinning only a device area enclosed by an outer peripheral surplus area but also enables a device to be divided in a regular way. SOLUTION: This method forms a separation groove 9 of a depth equal to a finish thickness of a semiconductor chip 3 in a boundary between a device area 5 and an outer peripheral surplus area 6 on a wafer 1, pastes a protective tape 7 whose adhesion deteriorates depending on ultraviolet exposure to the surface, and then grinds a portion corresponding to the device area 5 at the rear to form a thick reinforced area 8 at an area corresponding to the outer peripheral surplus area 6. Next, this method applies ultraviolet rays only to a paste area for the reinforced area 8 of the protective tape 7 to remove the reinforced area 8 from the protective tape 7, and separates it from the device area 5. Finally, it mounts a dicing frame 42 on the rear of the wafer 1 with only the device area 5 left via a dicing tape 41 to divide the wafer 1 into the semiconductor chip 3. COPYRIGHT: (C)2007,JPO&INPIT |
