MULTI-LAYERED ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To efficiently form a plating film of an even thickness by electroplating on a terminal electrode with a resistor film of a multi-layered electronic part in which a resistor device is compounded by forming the resistor film on the terminal electrode.

SOLUTION: The resistor film 21 is formed directly on the surface of the part body 2 for forming the terminal electrode 11. A conductive resin film 22 exhibiting a relatively low volume resistivity is formed so that it may cover the resistor film 21. The conductive resin film 22 preferably exhibits a specific resistance lower than 1×10-4(Ωm). The plating film 23 of an even thickness can be formed on it by electroplating.

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