| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method on a double-sided printed wiring board for checking whether or not foreign matter exists between via holes and a circuit pattern. SOLUTION: The plurality of via holes 4 for a circuit are formed in places other than a peripheral part of an insulating substrate 1. A plurality of through holes 5 for inspection are provided lengthwise and crosswise at regular intervals in the peripheral part of the insulating substrate 1 to form a test coupon 7 comprising a plurality of via holes 6 for inspection by filling the respective through holes 5 with a conductive paste 3. Further, metal layers 8 are formed on both sides of the insulating substrate 1, and then, circuit patterns 9 are formed by performing etching on places other than the peripheral part of the insulating substrate 1 while removing the metal layers 8 in the peripheral part of the insulating substrate 1. The surface thus exposed of the conductive paste 3 in the via holes 6 for inspection is observed to check whether or not foreign matter 15 exists. Based on the result thereof, it is determined whether or not the foreign matter 15 exists between the conductive paste 3 in the via hole 4 and the metal layers 8. COPYRIGHT: (C)2007,JPO&INPIT
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