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发明名称
Method of making metallization and contact structures in an integrated circuit
摘要
申请公布号
EP1168434(B1)
申请公布日期
2007.04.11
申请号
EP20010401542
申请日期
2001.06.14
申请人
CYPRESS SEMICONDUCTOR CORPORATION
发明人
BLOSSE, ALAIN;THEDKI, SANJAY;QIAO, JIANMIN;GILBOA, YITZHAK
分类号
H01L21/3065;H01L21/28;H01L21/768;H01L21/302;H01L21/311;H01L21/60
主分类号
H01L21/3065
代理机构
代理人
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