| 摘要 |
<p>A PCB assembly ( 1 ) in this case a DC-DC converter comprising a single layer board ( 2 ), mounts power semi-conductor devices forming high heat generating components ( 3 ) and various cores of magnetic material forming heat dissipating components ( 4 ). Tracks of heat conductive coupling material ( 6 ) lie above or below each heat generating component ( 3 ) and project into one of the heat dissipating components ( 4 ) and beside the others. In one embodiment, the heat generating components ( 3 ) are housed within a heat dissipating component ( 3 ). In another PCB assembly, there is an additional plug-in PCB which may itself carry heat generating components ( 3 ) or only heat dissipating components ( 4 ). In the latter case, the heat generating components ( 3 ) are mounted on the PCB assembly below the additional plug-in PCB.</p> |
