发明名称 Structure and method to form source and drain regions over doped depletion regions
摘要 A structure and method of reducing junction capacitance of a source/drain region in a transistor. A gate structure is formed over on a first conductive type substrate. We perform a doped depletion region implantation by implanting ions being the second conductive type to the substrate using the gate structure as a mask, to form a doped depletion region beneath and separated from the source/drain regions. The doped depletion regions have an impurity concentration and thickness so that the doped depletion regions are depleted due to a built-in potential creatable between the doped depletion regions and the substrate. The doped depletion region and substrate form depletion regions between the source/drain regions and the doped depletion region. We perform a S/D implant by implanting ions having a second conductivity type into the substrate to form S/D regions. The doped depletion region and depletion regions reduce the capacitance between the source/drain regions and the substrate.
申请公布号 US7202133(B2) 申请公布日期 2007.04.10
申请号 US20040761613 申请日期 2004.01.21
申请人 CHARTERED SEMICONDUCTOR MANUFACTURING, LTD. 发明人 CHUI KING JIEN;BENISTANT FRANCIS;SAMUDRA GANESH SHAMKAR;TEE KIAN MENG;LI YISUO;LEONG KUM WOH VINCENT;TEE KHENG CHOK
分类号 H01L21/26;H01L21/336;H01L21/8238;H01L29/08;H01L29/76;H01L29/78 主分类号 H01L21/26
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