Method and device for extracting an electronic chip from a silicon wafer and transporting the chip to its installation location on an electronic device

摘要

The invention concerns a method for extracting chips ( 20 ) from a silicon wafer ( 10 ) and for transferring each chip on an electronic device including the following steps: Extracting the good chips from the silicon wafer ( 10 ) and transferring them on a roll-up adhesive film ( 28 ) so that the chips are spaced out by a certain distance, Transferring the chips ( 20 ) from the roll-up film ( 28 ) directly and continuously on contacts ( 46, 48 or 58, 60 ) of the electronic device.