首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
METHOD OF MANUFACTURING LAMINATED CHIP MODULE
摘要
申请公布号
KR100706703(B1)
申请公布日期
2007.04.05
申请号
KR20060023116
申请日期
2006.03.13
申请人
AMOTECH CO., LTD.
发明人
LEE, JONG HYUN
分类号
H01L23/12
主分类号
H01L23/12
代理机构
代理人
主权项
地址
您可能感兴趣的专利
ASSEMBLING METHOD FOR LADDER
CIRCUIT FOR CONTROLLING GAIN IN SYSTEM USING RF CIRCUIT
METHOD FOR FORMING PHASE SHIFT MASK
WAFER LEVEL PACKAGE
WAFER LEVEL PACKAGE AND METHOD FOR MANUFACTURING THE SAME
METHOD FOR MONITORING V5.2 PROTOCOL MESSAGE
DECISION AREA CORRECTING CIRCUIT FOR SOLVING PHASE SHIFT ERROR DUE TO PHASE NOISE
METHOD FOR AUTOMATICALLY TESTING PACKET LINE IN INFORMATION COMMUNICATION PROCESSING SYSTEM
DRUM BRAKE FOR VEHICLE
LARGE-CURRENT PRINTED CIRCUIT BOARD
METHOD FOR MANUFACTURING OF TFT
LIQUID CRYSTAL DISPLAY DEVICE WITH HIGH APERTURE RATE
PREPARING METHOD FOR LOSS OF HAIR PREVENTION-DRUG
SYNCHRO-MESH FOR MANUAL TRANSMISSION
METHOD FOR FORMING TRENCH TYPE ISOLATION LAYER OF SEMICONDUCTOR DEVICE
METHOD FOR TESTING NORMAL PACKAGE AND LOAD BOX PACKAGE
STRUCTURE FOR CONNECTING AUXILIARY SUBSTRATE FOR IMAGE RECORDING/REPRODUCING DEVICE
HORN STRUCTURE OF ULTRASONIC GRINDER
HEAVY METAL REMOVAL METHOD USING ELVAN
YELLOW SOIL LIQUID POULTICE PACK
