SURFACE POLISHING AGENT COMPRISING NANO SIZED TUNGSTEN CARBIDE POWDERS AND POLISHING METHODS USING THE SAME

摘要

Disclosed are a method of polishing a body or a substrate such as a wafer for use in optical and electrical parts, and a polishing agent used therefor. This invention provides a method of polishing a subject, including providing a polishing agent containing tungsten carbide powder and a lubricant onto a metal platen and polishing the subject with the polishing agent containing tungsten carbide powder while rotating the metal platen. According to this invention, a subject that is good with respect to both flatness and roughness can be provided while assuring a fast polishing time period. Particularly, a sapphire wafer having minimum faults and glass and synthetic quartz plates having high flatness can be provided. Further, the method of this invention can be applied to polishing s ingle- crystal wafers such as silicon wafers or lithium tantalate wafers.