发明名称 COATING COMPOSITION FOR FORMING DIELECTRIC LAYER
摘要 PROBLEM TO BE SOLVED: To provide a coating composition suitable for a material for forming dielectric layer of a PDP and an inter-layer insulation film of an SED made to have a relative dielectric constant of 5 or less by combination of a wet process and heating process of 600°C or less. SOLUTION: The coating composition for forming the dielectric layer containing nano-size particles and a water-soluble organic dispersant is used. The dielectric layer is manufactured by applying heat treatment on a flat film after forming the flat film by coating the coating composition on a substrate by using such methods as spraying, dip coating, spin coating, doctor blade coating, gravure coating, die coating, cap coating. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007087636(A) 申请公布日期 2007.04.05
申请号 JP20050272132 申请日期 2005.09.20
申请人 ASAHI KASEI ELECTRONICS CO LTD 发明人 MATSUI MASAHIRO
分类号 H01J11/02;B05D7/24;C03C17/25;C09D5/02;C09D7/12;C09D201/00;H01J9/02;H01J11/22;H01J11/24;H01J11/34;H01J11/38;H01J31/12 主分类号 H01J11/02
代理机构 代理人
主权项
地址