发明名称 |
Circuit Board and Method of Manufacturing Circuit Board |
摘要 |
A circuit board includes: a plurality of wiring layers; an insulating layer which insulates the plurality of wiring layers, the insulating layer containing a fibrous filler and a resin; and a conductor part formed on a sidewall of a via piercing through the insulating layer. The fibrous filler protrudes from the sidewall and is covered with the conductor part, with a length greater than the thickness of the conductor layer.
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申请公布号 |
US2007074904(A1) |
申请公布日期 |
2007.04.05 |
申请号 |
US20060536317 |
申请日期 |
2006.09.28 |
申请人 |
KOHARA YASUHIRO;USUI RYOSUKE;KOJIMA NORIAKI |
发明人 |
KOHARA YASUHIRO;USUI RYOSUKE;KOJIMA NORIAKI |
分类号 |
H05K1/11;H01R12/04 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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