发明名称 Circuit Board and Method of Manufacturing Circuit Board
摘要 A circuit board includes: a plurality of wiring layers; an insulating layer which insulates the plurality of wiring layers, the insulating layer containing a fibrous filler and a resin; and a conductor part formed on a sidewall of a via piercing through the insulating layer. The fibrous filler protrudes from the sidewall and is covered with the conductor part, with a length greater than the thickness of the conductor layer.
申请公布号 US2007074904(A1) 申请公布日期 2007.04.05
申请号 US20060536317 申请日期 2006.09.28
申请人 KOHARA YASUHIRO;USUI RYOSUKE;KOJIMA NORIAKI 发明人 KOHARA YASUHIRO;USUI RYOSUKE;KOJIMA NORIAKI
分类号 H05K1/11;H01R12/04 主分类号 H05K1/11
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