发明名称 INTEGRATED CIRCUIT CAPACITOR STRUCTURE
摘要 Embodiments of the invention include a MIM capacitor that has a high capacitance that can be manufactured without the problems that affected the prior art. Such a capacitor includes an upper electrode, a lower electrode, and a dielectric layer that is intermediate the upper and the lower electrodes. A first voltage can be applied to the upper electrode and a second voltage, which is different from the first voltage, can be applied to the lower electrode. A wire layer, through which the first voltage is applied to the upper electrode, is located in the same level as or in a lower level than the lower electrode.
申请公布号 US2007072319(A1) 申请公布日期 2007.03.29
申请号 US20060559317 申请日期 2006.11.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 AHN JEONG-HOON;LEE KYUNGTAE;JUNG MU-KYUNG;LEE YONG-JUN
分类号 H01L21/3205;H01L21/66;G01R31/26;H01G4/00;H01L21/02;H01L21/28;H01L21/331;H01L21/768;H01L21/82;H01L21/822;H01L21/8242;H01L23/522;H01L27/04;H01L27/08;H01L27/108 主分类号 H01L21/3205
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