| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a submount material in which the lifting of a metal circuit layer is small even in the case where heat impact is exerted during an assembly step and in use and heat dissipation property, durability, and reliability are excellent. SOLUTION: In a substrate 2a for a submount material using an aluminum nitride substrate whose thermal conductivity is equal to or more than 170 (W/m K), the longitudinal and transversal lengths of the aluminum nitride substrate is equal to or less than 1 mm and K/t ratio is equal to or more than 700 in the case where the thermal conductivity of the aluminum nitride substrate is K (W/m K) and thickness is t (mm). COPYRIGHT: (C)2007,JPO&INPIT |
