发明名称 |
MODULE FOR TACTILE SENSOR AND METHOD FOR PACKAGING TACTILE SENSOR |
摘要 |
A module for tactile sensor exhibiting high adaptability to a complex curved surface in which regulation in density of a sensor elements and regulation o f packaging region can be facilitated even by only one type of module. The module for tactile sensor has a flexible substrate provided with a plurality of sensor elements, communication terminals, and electronic circuit parts wherein the flexible substrate consists of a plurality of stripe portions. T he sensor element is provided at the end of the stripe portion wherein the sens or element and the electronic circuit part, and the electronic circuit part and the terminal are connected electrically through wiring extending from the stripe portion. At least one stripe portion has a bendable region and/or a cuttable region.
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申请公布号 |
CA2622244(A1) |
申请公布日期 |
2007.03.22 |
申请号 |
CA20062622244 |
申请日期 |
2006.09.05 |
申请人 |
THE UNIVERSITY OF TOKYO;NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCEAND TECHNOLOGY |
发明人 |
OHMURA, YOSHIYUKI;KUNIYOSHI, YASUO;SETA, NAOKO;NAGAKUBO, AKIHIKO |
分类号 |
G01L5/00;G01L1/24 |
主分类号 |
G01L5/00 |
代理机构 |
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主权项 |
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