| 摘要 |
A heat dissipating system adapted for cooling an electronic device includes: a heat sink adapted to be connected to the electronic device; a driving mechanism; a cooling mechanism; a coolant circulating conduit adapted for receiving a coolant therein, and connected to the heat sink, the driving mechanism, and the cooling mechanism such that the driving mechanism drives circulation of the coolant in the coolant circulating conduit through the heat sink and the cooling mechanism; and a fan unit disposed rotatably in the heat sink, and driven to rotate by the coolant flowing through the heat sink.
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