| 摘要 |
A power connector assembly is provided that has high power density capability and controllable impedance. One embodiment has a multi-layer stack of printed circuit boards that each contain one or more metal layers that function selectively as power and return planes. The metal layers are electrically in contact with contact arrays of connectors, such as through half vias or slot vias for example, which mate with corresponding contact arrays of connectors associated with the circuits being connected together. Discrete components may be used to further control impedance of the connector. Different connector technologies may be used for connecting contacts to the metal layers.
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