发明名称 Positive resist composition and method of forming resist pattern using same
摘要 A positive resist composition capable of realizing an improvement in resolution, a reduction in LER, and a reduction in the level of defects, as well as a method of forming a resist pattern. This composition and method provide: a positive resist composition comprising a resin component (A) containing a structural unit (a1) derived from an (alpha-methyl)hydroxystyrene, represented by a general formula (1) shown below, and a structural unit (a2) represented by a general formula (2) shown below, wherein the solubility rate of the component (A) in a 2.38% by weight aqueous solution of TMAH (tetramethylammonium hydroxide) is within a range from 100 to 1000 Å/second, as well as a method of forming a resist pattern that uses such a composition; (wherein in the general formulas (1) and (2), R represents a hydrogen atom or a methyl group).
申请公布号 US7192687(B2) 申请公布日期 2007.03.20
申请号 US20040931958 申请日期 2004.09.01
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 NITTA KAZUYUKI;OHKUBO WAKI;SHIMATANI SATOSHI
分类号 G03F7/40;C08F212/14;G03C1/76;G03F7/004;G03F7/022;G03F7/039;H01L21/027 主分类号 G03F7/40
代理机构 代理人
主权项
地址