| 摘要 |
An epoxy resin composition for encapsulating a semiconductor chip, which has good flowability without deterioration in curability. Specifically, a resin composition for encapsulating a semiconductor chip containing an epoxy resin (A), a phenol resin (B), an inorganic filler (C) and a curing accelerator (D) as main components, and further containing a silane coupling agent (E) in 0.01 wt % to 1 wt % both inclusive of the total amount of the epoxy resin composition and Compound (F) contains two hydroxyl groups combined with each of adjacent carbon atoms in an aromatic ring in more than or equal to 0.01 wt % of the total amount of the epoxy resin composition. |
