Method of manufacturing a semiconductor device

摘要

The compound of the present invention is represented by the following formula 1: wherein R¹, R², R⁴, R⁵, m0 to m2, and n0 to n2 are as defined in the description. Radiation sensitive compositions containing the compound of the formula 1 as a main component of the solid component are excellent in sensitivity, resolution, heat resistance, etching resistance, and solubility in solvent.