| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board having a through-hole with a high aspect ratio in which the plating thickness of the inner wall of the through-hole is increased sufficiently, and having a fine circuit pattern in the outer layer. SOLUTION: The board includes a fine circuit pattern 14 and a through-hole 12. The fine circuit pattern 14 is formed by a plating 62 on a copper foil 20 which is held on a temporary substrate 50 to allow delamination, and is exposed on the surface after being transferred to a main substrate 16 with the copper foil. In the through-hole 12, a pad 22 is formed on the copper foil 20. The pad 22 of the through-hole 12 is formed on the copper foil 20 that has been transferred to the main substrate 16 from the temporary substrate 50. The fine circuit pattern 14 is the one that has been formed on the copper foil 20 of the temporary substrate 50 by plating and transferred to the main substrate 16. Therefore, the fine circuit pattern 14 can be made sufficiently thin. COPYRIGHT: (C)2007,JPO&INPIT
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