发明名称 METHOD FOR REMOVING SILICON RUBBER RESIDUES
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for removing silicon rubber residues adhered on a substrate during laminating without damaging the substrate. <P>SOLUTION: A laminate film 20 is pressed onto a substrate 10 by means of a first laminator roll 30 provided with a first silicon rubber 31, an organic material 22 applied to a resin film 21 on the laminate film 20 is transcribed onto the substrate 10, and then the residue 50 of the silicon rubber 31 adhered to the substrate 10 during pressing by the first laminator roll 31 is exposed to oxygen ion (O<SB>2</SB><SP>-</SP>) for removal. Concretely, the residue 50 is removed by being exposed to ultraviolet radiation in a chamber 70 in an oxygen environment (O<SB>2</SB>) with the substrate 10, or it is removed by oxygen plasma treatment in the atmosphere. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007059757(A) 申请公布日期 2007.03.08
申请号 JP20050245477 申请日期 2005.08.26
申请人 SANYO EPSON IMAGING DEVICES CORP 发明人 HIRAYAMA CHISATO
分类号 H01L21/304;G02B5/20;G02F1/1335 主分类号 H01L21/304
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