| 摘要 |
A method for cutting a fuse in a semiconductor device is provided to improve the stability of device by restraining the influence of a laser beam on an unwanted fuse using an improved hole arrangement. A method of cutting a fuse in a semiconductor device is used for cutting at least one out of a plurality of fuses(402 to 404) spaced apart from each other in an insulating layer(400). A plurality of holes(411) for exposing partially the fuses to the outside are formed through the insulating layer. The plurality of holes are arranged like a zigzag type structure. A fuse only is cut through a corresponding hole by using a laser beam.
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