| 发明名称 |
Housing cup for an electronic component with integrated cooling body |
| 摘要 |
A housing of an electronic component with an integrated cooling body is provided. The cup base of the housing is formed as a cooling body. The cooling body and the housing cup are formed integrally by an extrusion method.
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| 申请公布号 |
US2007053156(A1) |
申请公布日期 |
2007.03.08 |
| 申请号 |
US20040577413 |
申请日期 |
2004.10.28 |
| 申请人 |
REGENFUS LOTHAR |
发明人 |
REGENFUS LOTHAR |
| 分类号 |
H05K7/20;H01C1/084;H01G2/08;H01G9/08;H01M8/02;H01M8/12 |
主分类号 |
H05K7/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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