GRINDING APPARATUS AND GRINDING METHOD FOR PLATE-LIKE MATERIAL TO BE GROUND

摘要

PROBLEM TO BE SOLVED: To easily grind a plate-like material to be ground to a uniform thickness in a simple constitution. SOLUTION: The center X of rotation of chuck table 10 and the center Y of rotation of a grinding wheel 25 are offset and disposed so that a grinding stone 27 is placed on the center X of rotation of a chuck table 10. A first air bearing 13 is provided with a pair of chuck side pressure ports, and a second air bearing 26 is provided with a pair of grinding wheel side pressure ports. A housing 12 for the first air bearing 13 is constructed so that the angle of inclination of an abut surface of a wafer 9 to the grinding stone 27 is adjusted. The housing 12 for the first air bearing 13 is inclined, based upon a pressure difference PAC, PBWdetected at the pair of chuck side pressure ports 1 and the pair of grinding wheel side pressure port. COPYRIGHT: (C)2007,JPO&INPIT