ADHESIVE COMPOSITION

摘要

Disclosed is an adhesive composition which is free from problems involved in conventional thermosetting resins while having adhesiveness sufficient for electronic component mounting, desired electrical characteristics and long-term durability. Specifically disclosed is an adhesive composition containing a photoacid generator, a dye having an absorption in a range of 380-1000 nm and a cationically photopolymerizable composition. This adhesive composition generates an acid and starts a cationic photopolymerization reaction when irradiated with visible or near infrared light, thereby being cured. Also disclosed is an adhesive composition containing a radical generator, a dye having an absorption in a range of 380-1000 nm and a radically photopolymerizable composition. This adhesive composition is cured by starting a radical polymerization reaction when it is irradiated with visible or near infrared light. These adhesive compositions are used for mounting electronic components.