| 摘要 |
A structure and method ( 1000 ) of forming an interface for a ball grid array includes forming pad ( 204 ), ( 1002 ) on a substrate ( 202 ) and creating a positive feature ( 206 ) on the pad ( 1004 ). The positive feature ( 206 ) provides an interface for a solder ball ( 208 ). The improved pad can be incorporated as part of BGA substrate or as part of a printed circuit board substrate. The positive feature ( 206 ) provides a contoured or uneven profile having vertical surfaces that increase the pad's surface area without taking up additional substrate space. The vertical surface area interrupts propagation of any fracture incurred during drop and vibration.
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