发明名称 Assembly with a power semiconductor module and a connector
摘要 <p>The arrangement includes a power semiconductor module that has a housing (3), and connectors (6) for load connection and auxiliary connections. Spring contact components are arranged projecting from the housing. The housing is also provided with first connecting units for coupling with the connectors, and second connecting units (62,64) and metal molded portion (7) with contact areas for coming in contact with the spring contact components. The metal molded portion also has contact sections (70) for external connection of the power semiconductor module.</p>
申请公布号 EP1758214(A1) 申请公布日期 2007.02.28
申请号 EP20060017500 申请日期 2006.08.23
申请人 SEMIKRON ELEKTRONIK GMBH & CO. KG 发明人 EBERSBERGER, FRANK;STEGER, JUERGEN
分类号 H01R31/06 主分类号 H01R31/06
代理机构 代理人
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