| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent that a passive component is brought into contact with a die pad in a semiconductor device, constituted by connecting a semiconductor chip and the passive component with bonding wires, wherein the passive component is mounted via insulating paste-like adhesives on the die pad mounting the semiconductor chip. <P>SOLUTION: After applying a first insulating adhesive on the die pad, the first insulating adhesive is made to harden. On the hardened first insulating adhesives, a second insulating adhesive is applied further so that the passive component may be attached fixedly. Even if stress is added at the time of arranging the passive component on the die pad, passive component is prevented from coming into direct contact with the die pad due to the first insulating adhesive. Then, the connection is carried out between the electrode pad of the semiconductor device on the die pad and the terminal of the passive component by wire bonding. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
