发明名称 |
Partially etched leadframe packages having different top and bottom topologies |
摘要 |
A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion, and the topology of the top surface differs from the topology of the bottom surface.
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申请公布号 |
US2007040231(A1) |
申请公布日期 |
2007.02.22 |
申请号 |
US20060338439 |
申请日期 |
2006.01.24 |
申请人 |
HARNEY KIERAN P;MARTIN JOHN R;FELTON LAWRENCE E |
发明人 |
HARNEY KIERAN P.;MARTIN JOHN R.;FELTON LAWRENCE E. |
分类号 |
H01L29/84 |
主分类号 |
H01L29/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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