发明名称 PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To inhibit the occurrence of electromagnetic interference between different types of circuit and EMI due to electromagnetic coupling in a GHz band, in a power supply system of a printed circuit board or a semiconductor package. SOLUTION: The printed circuit board comprises a power supply layer 21, a ground layer 22, and a dielectric layer 23. The dielectric layer 23 comprises two kinds of base materials 24 having specific inductive capacities different from each other and a patch 25. Between the power supply layer 21 and the ground layer 22, the patches 25 are periodically arrayed between the base materials 24. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007049096(A) 申请公布日期 2007.02.22
申请号 JP20050234843 申请日期 2005.08.12
申请人 NEC CORP 发明人 IWANAMI MIZUKI
分类号 H05K1/02;H01L23/12;H01L23/14;H01L23/15 主分类号 H05K1/02
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