发明名称 FILM DEPOSITION APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a film deposition apparatus which can simultaneously and uniformly perform the plasma treatment to a plurality of three-dimensional vessels by using one power supply source. SOLUTION: In the film deposition apparatus to deposit a thin film on a surface of a three-dimensional vessel by a CVD method, a film deposition chamber comprises an external electrode body formed of a conductive material with a plurality of vessel-shaped spaces for storage provided therein, an external electrode plate formed of a conductive material which is installed on an upper part of the external electrode body, a bottom lid having an exhaust port which is installed on a lower part of the external electrode body, and a vessel holding component disposed on the bottom lid, and an internal electrode is inserted in each vessel held by the vessel holding component through the bottom lid.</p>
申请公布号 JP2003138379(A) 申请公布日期 2003.05.14
申请号 JP20010334383 申请日期 2001.10.31
申请人 TOPPAN PRINTING CO LTD 发明人 KUSAKA NAOTO;MATSUOKA TAKEYUKI
分类号 B65D1/00;B65D1/09;C23C16/50;(IPC1-7):C23C16/50 主分类号 B65D1/00
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