| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit and a burn-in test method that enable a package burn-in test. SOLUTION: The semiconductor integrated circuit includes an input-output circuit, a transmission controller, and a test controller. The transmission controller applies an operation signal to the control node of the input-output circuit or cuts of it based on a normal operation mode or a test mode. The test controller outputs a first signal and a second signal to the control node in the test mode sequentially, and the test controller generates the first signal in a fixed time during a total time that the test mode is carried out and the second signal is generated for the remaining time. COPYRIGHT: (C)2007,JPO&INPIT
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