| 摘要 |
A semiconductor component ( 10 ) has an interposer substrate ( 1 ) as stack element of a semiconductor component stack ( 25 ). The interposer substrate ( 1 ) has, on one of the interposer substrate sides ( 2, 4 ), a semiconductor chip protected by plastics composition ( 12 ) in its side edges ( 22 ). An interposer structure ( 3 ) partly covered by a plastics composition ( 12 ) is arranged on the interposer side ( 2, 4 ) opposite to the semiconductor chip ( 6 ). Edge regions ( 11 ) of the interposer substrate ( 1 ) remain free of any plastics composition ( 12 ) and have, on both interposer sides ( 2, 4 ) external contact pads ( 7 ) which are electrically connected to one another via through contacts ( 8 ).
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