| 发明名称 |
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material |
| 摘要 |
Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula: |
| 申请公布号 |
US7179684(B2) |
申请公布日期 |
2007.02.20 |
| 申请号 |
US20050099907 |
申请日期 |
2005.04.05 |
| 申请人 |
INTEL CORPORATION |
发明人 |
SHI SONG-HUA;WANG LEJUN;CHEN TIAN-AN |
| 分类号 |
H01L21/00;B32B27/08;C09J161/34;C09J179/04;H01B3/30;H01B3/38;H01L21/56;H01L21/58;H01L23/29 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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