发明名称 SEMICONDUCTOR PACKAGE WITH FERRITE SHIELDING TEXTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device including one or more ferrite structures for relaxing a high frequency noise to be generated in a signal line and termination point in a semiconductor device in a wafer level, and to provide a method of manufacturing the same. <P>SOLUTION: The semiconductor device includes a conductive pad formed on a substrate, a termination point electrically connected to the conductive pad, and a ferrite structure formed between the conductive pad and the termination point. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007043090(A) 申请公布日期 2007.02.15
申请号 JP20060145633 申请日期 2006.05.25
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 SONG EUN-SEOK;KANG UN-BYOUNG;LEE SI-HOON
分类号 H01L23/00;H01L21/60 主分类号 H01L23/00
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