| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing having reliability such as excellent flame resistance, moldability, reflow resistance, moisture resistance and characteristics after being left at a high temperature, and suitable for sealing VLSI and to provide an electronic part device having an element sealed with the composition. SOLUTION: The epoxy resin composition for sealing contains (A) an epoxy resin, (B) a curing agent, and (C) a compound of the general formula (I). Formula (I) (wherein A may be the same or different, and is a 1-18C substituted or unsubstituted aromatic hydrocarbon group, n is an integer of 0-20, and B may be the same or different, and is a 1-18C substituted or unsubstituted aromatic hydrocarbon group). COPYRIGHT: (C)2007,JPO&INPIT
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