HEATING AND COOLING OF SUBSTRATE SUPPORT

摘要

PROBLEM TO BE SOLVED: To provide a substrate supporting assembly for controlling the temperature of a substrate in a process chamber, and to provide a method therefor. SOLUTION: The substrate supporting assembly has: a heat conductor including a stainless steel material; a substrate supporting surface on the surface of the heat conductor for supporting a substrate of large area; one or more heating elements embedded in the heat conductor; a cooling plate positioned under the heat conductor; a base supporting structure positioned under the cooling plate for structually supporting the heat conductor while comprising the stainless steel material; and one or more cooling channels supported by the base supporting structure and positioned between the cooling plate and the base supporting structure. There is provided a process chamber including the substrate supporting assembly. COPYRIGHT: (C)2007,JPO&INPIT