发明名称 METHOD OF INSPECTING SENSOR DEVICE STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To evaluate simply and nondestructively the film thickness of an insulating film on a silicon substrate, in an inspection method of an acceleration sensor wherein glass is anode-jointed to the silicon substrate. <P>SOLUTION: The acceleration sensor 10 is equipped with the silicon substrate 1, glasses 3, 2 anode-jointed to the upper and lower sides of the silicon substrate 1, a silicon oxide film 7 and a silicon nitride film 8 which are insulating films formed on the silicon substrate 1, a cantilever 1a having a cantilever structure formed in the silicon substrate 1, and a piezoresistance 4 formed on the surface of the silicon substrate 1. The sensor is also equipped with an aluminum electrode 6 used also for inspection, provided beforehand on the silicon nitride film 8; and an aluminum electrode 5b conductive to the silicon substrate 1. In the sensor, a capacitance meter 11 is connected between the aluminum electrode 5b and a measuring terminal 6a of the aluminum electrode 6, and a capacitance between the silicon substrate 1 and the aluminum electrode 6 is measured. The film thickness of the insulating films on the silicon substrate 1 can be determined quantitatively, and the quality of the film thickness can be evaluated easily and nondestructively. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007033212(A) 申请公布日期 2007.02.08
申请号 JP20050216494 申请日期 2005.07.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 YASUIKE NORIYUKI;MAKINO SHIGERU;YAMADA SHUGO
分类号 G01N27/22;G01P15/12;G01P21/00;H01L21/66;H01L29/84 主分类号 G01N27/22
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