发明名称 HEAT INSULATING STRUCTURE AND HEAT INSULATING PANEL
摘要 PROBLEM TO BE SOLVED: To provide a heat insulating structure which is excellent in the heat insulation property of not only the central part of a panel but also a part along a joint part, and which hardly deteriorates the heat insulation property. SOLUTION: In this heat insulating structure, a core part equipped with a void communicating with an outside is coated with an airtight film 11; and a plurality of heat insulating panels 1, in which the inside of the airtight film is sealed in a decompressed state, are arranged in such a manner that end surfaces of the panels face each other, and mounted on the side of a surface A to be thermally insulated. In the heat insulating panel for use, a step part 5 is provided along the outer periphery of the panel, and an outer-periphery heat insulating part 6 with a panel thickness smaller than that of the central part of the panel is formed. The plurality of heat insulating panels are arranged in such a manner that the step parts face each other in the state of sandwiching the joint part 8 in between, and mounted on the side of the surface to be thermally insulated. The heat insulating panel 9 for the joint part, which covers the joint part, is provided in such a manner as to get into a section across the step parts on both sides, sandwiching the joint part. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007032066(A) 申请公布日期 2007.02.08
申请号 JP20050216155 申请日期 2005.07.26
申请人 MEISEI IND CO LTD 发明人 ISHIDA YOSHIHARU;MARUYAMA KOJI;SHIMONO KAZUAKI
分类号 E04B1/80 主分类号 E04B1/80
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