| 摘要 |
An addition curable silicone resin composition for a light emitting diode is provided The composition includes an organopolysiloxane that includes a straight-chain segment represented by a formula: -(R<SUP>1</SUP><SUB>2</SUB>SiO)<SUB>n</SUB>- wherein, R<SUP>1 </SUP>is an unsaturated aliphatic bonding-free monovalent hydrocarbon group, and n is an integer of 1 or greater, and a resin-like segment consisting of R<SUP>2</SUP><SUB>3</SUB>SiO<SUB>1/2 </SUB>units wherein, R<SUP>2 </SUP>is a monovalent hydrocarbon group, an alkoxy group, or a hydroxyl group, SiO<SUB>2 </SUB>units, and/or R<SUP>2</SUP>SiO<SUB>3/2 </SUB>units wherein, R<SUP>2 </SUP>is as defined above, in which at least two of all the R<SUP>2 </SUP>groups are alkenyl groups. The composition exhibits strong resistance to thermal shock, and is resistant to cracking even under severe temperature cycling.
|
