| 摘要 |
A method for manufacturing a printed circuit board for a probe card is provided to improve a performance of the probe card to check a semiconductor element by increasing a surface flatness of the printed circuit board. A method for manufacturing a printed circuit board for a probe card includes the steps of: adding an inter-adhesive between a plurality of inner layer PCBs having a circuit pattern on a surface and a copper thin film of an outermost layer; and stacking the plurality of inner layer PCBs and the copper thin film by pressing at a predetermined temperature(ST30); removing a part of the inter-adhesive and the copper thin film of the outermost layer through surface grinding and planarizing(ST40); attaching the copper thin film by spraying the inter-adhesive on the planarized outermost layer(ST50); forming a penetration hole which penetrates the inner layer PCB and the outermost copper thin film, and forming a plating layer which is electrically connected to a circuit pattern of the inner PCB on an inner wall of the penetration hole(ST60); and forming a circuit pattern by processing the copper thin film attached to the outermost layer(ST70).
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