发明名称 |
MASK, MASK CHIP, METHOD OF MANUFACTURING MASK, METHOD OF MANUFACTURING MASK CHIP, AND ELECTRONIC EQUIPMENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mask capable of forming a pattern on a large substrate for film deposition with high accuracy. <P>SOLUTION: The mask 1 comprises a plurality of mask chips 20 joined with each other via a supporting member 10. A plurality of first apertures 22 corresponding to the pattern to be formed are formed in the plurality of mask chips 20. A cutout part 20f is formed in at least one side surface out of side surfaces facing each other of the adjacent mask chips 20, 20. A space part composed of the cutout part 20f and including a second aperture 22a corresponding the pattern is formed in a joint part with the mask chips 20 adjacent to each other joined therewith. A blocking part 26 for covering a space part 22b other than the second aperture 22a is formed on at least one of the mask chips 20 adjacent to each other. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007023358(A) |
申请公布日期 |
2007.02.01 |
申请号 |
JP20050209535 |
申请日期 |
2005.07.20 |
申请人 |
SEIKO EPSON CORP |
发明人 |
YOTSUYA SHINICHI;KUWABARA TAKAYUKI;KOEDA SHUJI |
分类号 |
C23C14/04;C23C14/12;C23C14/24;H01L51/50;H05B33/10 |
主分类号 |
C23C14/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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