发明名称 MASK, MASK CHIP, METHOD OF MANUFACTURING MASK, METHOD OF MANUFACTURING MASK CHIP, AND ELECTRONIC EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a mask capable of forming a pattern on a large substrate for film deposition with high accuracy. <P>SOLUTION: The mask 1 comprises a plurality of mask chips 20 joined with each other via a supporting member 10. A plurality of first apertures 22 corresponding to the pattern to be formed are formed in the plurality of mask chips 20. A cutout part 20f is formed in at least one side surface out of side surfaces facing each other of the adjacent mask chips 20, 20. A space part composed of the cutout part 20f and including a second aperture 22a corresponding the pattern is formed in a joint part with the mask chips 20 adjacent to each other joined therewith. A blocking part 26 for covering a space part 22b other than the second aperture 22a is formed on at least one of the mask chips 20 adjacent to each other. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007023358(A) 申请公布日期 2007.02.01
申请号 JP20050209535 申请日期 2005.07.20
申请人 SEIKO EPSON CORP 发明人 YOTSUYA SHINICHI;KUWABARA TAKAYUKI;KOEDA SHUJI
分类号 C23C14/04;C23C14/12;C23C14/24;H01L51/50;H05B33/10 主分类号 C23C14/04
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