| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of obtaining a laminate structure easily coping with a change in the design of a wiring pattern by increasing the degree of freedom in the layout of leads. SOLUTION: In this semiconductor device 1, an MOSFET chip 2 is fixed on a die pad 4 and a die pad 17 is fixed on the MOSFET chip 2 via an insulation resin 20. An SBD (Schottky barrier diode) chip 3 is fixed on the die pad 17 via an anisotropic conductive film 21. Electrodes of the MOSFET chip 2 or the SBD chip 3 are electrically connected to leads 10-12 via metal fine wires 14-16. This structure enables a package 8 to pull out leads 9-13 from desired directions, and the degree of freedom in the design of the lead can be increased. COPYRIGHT: (C)2007,JPO&INPIT |
