| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem of an open circuit in the case that parts in HGA provided with a slider and an FPC are connected to each other using anisotropic conductive adhesive. <P>SOLUTION: This is bonding structure of at least one bonding pad and an FPC on a suspension of an HGA used in a hard disk apparatus, the FPC is provided with a base film, a conductive layer positioned under the base film, and a overcoat layer positioned under the conductive layer, while a bottom plane is not superposed on an upper plane of at least one bonding pad at the time of connection, the conductive layer of the FPC is connected and fixed directly to at least one bonding pad by anisotropic conductive adhesive such as ACF. <P>COPYRIGHT: (C)2007,JPO&INPIT |
