| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method and an inspection device capable of inspecting accurately the junction part of a semiconductor device with a semiconductor element flip-chip mounted on a substrate by jointing bumps provided on an electrode. SOLUTION: In this inspection method/inspection device, the semiconductor element 1 is heated by self-heating of the semiconductor element 1 by impressing a current from a heating means 6, the temperature distribution on a reverse face of the bump 3 jointing face in the semiconductor element 1 is measured by a measuring means 7 by using heat radiation, through the bumps 3 of the heat heated by the semiconductor element 1, and measured data are compared with the data of a nondefectives by a determination means 8, to accurately determine the quality of a jointing state of the bumps 3. COPYRIGHT: (C)2007,JPO&INPIT
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