| 摘要 |
PROBLEM TO BE SOLVED: To prevent minute solder from being generated. SOLUTION: A substrate comprises a substrate body 11a having a solder surface while a through hole is formed at a prescribed part; and a land 16 that is arranged at the through hole and has an inner wall land section formed along the inner wall of the through hole and a solder surface land section formed along the solder surface at the periphery of the through hole. Then, in a soldered area set to the solder surface, a first film is formed along an edge section g2 comprising a part where the inner wall land section is in contact with the solder surface land section. In the soldered area, the first film is formed along the edge section g2, thus preventing minute solder from being generated near the edge section g2 when cutting solder. COPYRIGHT: (C)2007,JPO&INPIT
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